MediaTek’s highflier Dimensity 9300 chip comes on November 6

Let the chips fall where they may! MediaTek’s new highly anticipated chip, called Dimensity 9300 (MediaTek’s chip naming is hilarious; I could never not recall Harry Potter’s flying broomstick Nimbus 2000), is to be officially presented in just two weeks. This is going to happen somewhere in China on November 6.

Stakes are high for MediaTek, as this new chip is to directly compete with the one that Qualcomm has just officially introduced – the Snapdragon 8 Gen 3. Also, it has to keep in check whatever Exynos comes up with.

The Dimensity 9300 has no secrets to hide about its specifications (via 9to5Google). Real-life usage tests are the real deal, but that is not going to happen as fast as we would want to. On paper, though, things look pretty interesting – four Cortex-X4 cores (one of them is set to be the main powerhouse at 3.25GHz, compared to the rest at 2.85GHz), plus another four Cortex-A720 cores at 3GHz. Sources also state that the GPU will consist of an Immortalis G720.

Having four Cortex-X4 cores is no joke, but with great performance comes great heat, as Uncle Ben would tell Peter Parker if Peter Parker was a Dimensity 9300 chip. Prominent tipsters have talked about an alleged problem with the Dimensity 9300 and the way it (does not) control high temperatures.

Later, MediaTek called these claims “a rumor” that is “completely false and has no source or basis in fact”, so we’ll have to wait for this one out and see what’s what.

The Snapdragon 8 Gen 3 packs just a single Cortex-X4 core

Qualcomm says that the Snapdragon 8 Gen 3 provides a 30% boost in performance and a 20% hike in efficiency compared with its predecessor – the popular Snapdragon 8 Gen 2.

The new chip is based on ARM architecture. The prime CPU core is none other than the Cortex-X4, running at 3.3GHz (MediaTek’s Dimensity 9300 has a total of four of these, but none of them goes to 3.3GHz).

The rest of the configuration on the Snapdragon 8 Gen 3 includes five Kryo Cortex A720 CPU performance cores running at a speed as fast as 3.2GHz, and two Cortex A520 efficiency cores with a clock speed that peaks at 2.3GHz.

There is an Adreno GPU integrated with the chipset along with the Snapdragon X75 5G Modem-RF System which supports mmWave and sub-6GHz 5G and delivers 5G downlink speeds as fast as 10Gbps and uplink speeds of up to 3.5Gbps.