Samsung Galaxy S III to be just 7mm thin, quad-core processor and LTE regurgitated again

Samsung has reportedly managed to shrink the PCB board and other components in its upcoming Galaxy S III flagship 10-20% compared to its current achievements in the Galaxy S II, which is not too shabby at 8.49mm in its thinnest parts either.

This shrinkage has allowed it to make the Galaxy S III just 0.27" (7mm) thin. As far as we understood from Google's Korean translation, the Galaxy S III is expected to feature the same "hump" on the back where currently the 8MP camera on the Galaxy S II resides. In fact, the Korean source says it will feature an 8MP camera as well, capable of 1080p video recording, despite the hinted 12MP shooter that leaked in a shady presentation last year and was also confirmed by Eldar Murtazin not long ago, so the jury is still out on this one. There is also a mention of a 3D-enabled model, though it's not exactly clear if it's for the camera, the display, or both.

The translation is quite murky, but it clearly mentions the months May and March 2011 - May this year seems as a possible launch month, and the latter as the month since Samsung started working on the Galaxy S III. If this rumor holds water, making such a thin 0.27" chassis out of metal seems a bit of a stretch, so Samsung might have gone again with some kind of plastic for the Galaxy S III, despite many people wishing for a metal shell.

There will certainly be a lot more rumors in the meantime to clarify the build material, but a quad-core processor and LTE connectivity are mentioned in this rumor as well as the previous whispers from people in the know, so they seem pretty certain at this point. The mystery is whether it will be the 1.8GHz quad-core Exynos 4412, or the Exynos 5-series monsters that Samsung demonstrated to us recently powering a WQXGA display.

source: ETNews (translated) via SlashGear