Housing for Apple iPhone 6s leaks revealing changes inside, but no changes outside

This fall, Apple is expected to launch the Apple iPhone 6s and the Apple iPhone 6s Plus. A tipster inside Apple's supply chain has sent out images of what is alleged to be the housing for the next-generation iPhone models. The inside of the housing reveals that new mounting points will be used for the motherboard. This dovetails with earlier reports that said Apple would be using a combination of System in Package technology (SiP) and a PCB for the next iPhonemodels, before eliminating the PCB completely with the 2016 iPhones. Using a SiP saves space that Apple could use to house larger capacity batteries in its smartphones.

Despite a recent patent filing made by Apple for a material that would make antenna lines look like the metal housing of the phone, the lines show up on the pictures of the new housing. Microphones, speakers and connector ports will remain in the same exact places, looking exactly the same as they do on the current iPhone 6 and iPhone 6 Plus. The pictures also reveal that Apple will not be using a dual camera system as some have predicted. This could mean that we will see the rear camera protruding again on the next-generation iPhone models. We do expect to see a bump in the rear camera to 12MP from the current 8MP.

Inside, the Apple iPhone 6 and Apple iPhone 6s Plus are both expected to come with the Force Touch feature that allows the screen to react differently to a soft touch and a harder touch on the glass. Force Touch is currently used on the Apple Watch, and many believe that it will be a big sales driver for the new iPhone models. 

Meanwhile, you can check out a series of photos showing the housing for the next-gen iPhone handsets by clicking on the slideshow below.


source: 9to5Mac