World's thinnest LTE chip might make your next AT&T 4G LTE tablet Phat
The thinnest LTE chip, the AirPrime EM7700
source: SierraWireless via Engadget
Sierra Wireless has introduced the world's first thin form factor embedded wireless module for 4G LTE networks. The Sierra Wireless AirPrime™ EM7700 is a nominal 2.5 millimetres thick and is ideal for tablets and ultra-portable notebooks where thinness is a critical design constraint. The EM7700 is designed to support Windows 8, utilizes Qualcomm's Gobi™ 4G LTE modem and is compatible with Qualcomm's API and the USB-IF mobile Broadband Interface Model (MBIM) for easy integration by PC OEMs.
It offers a connectorized interface to enable build-to-order logistics, allowing manufacturers to offer it as an optional add-on to their devices. The AirPrime EM7700 also supports HSPA+ and 3G technologies for use in areas where LTE is not yet available.
Made exclusively for connecting to the AT&T 4G LTE network, the AirPrime EM7700 is based on the AirPrime MC7700 module, which was certified by AT&T last year
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