MediaTek unveils the 10nm Helio X30 chipset with a quad-core PowerVR 7XT GPU
MediaTek has announced today the Helio X30 chipset. Once again featuring a deca-core CPU and a tri-cluster design like the Helio X20 and X25, the chip will start shipping sometime next year. Built using TSMC's 10nm FinFET process, the Helio X30 will contain a deca-core CPU with four Cortex A-73 cores clocked at 2.8GHz to handle the toughest of tasks. Four Cortex A-53 cores will run at 2.2GHz, and two Cortex A-35 cores running at 2GHz will handle light housekeeping chores.
The chipset will support a camera carrying a sensor as high as 40MP, and video capture as high as 24MP. A 16MP camera can take video at 60fps, while an 8MP snapper will receive video support up to 120fps. The Helio X30 will work with a device sporting as much as 8GB RAM. This support comes in the form of two LPDDR4 POP 1600MHz channels. The GPU on board is a quad-core PowerVR 7XT, which makes it perfect for the upcoming explosion in VR enabled devices.
source: PhoneRadar
The modem supports three carrier aggregation and LTE Cat. 12. We would expect to see the Helio X30 SoC powering some high-end smartphones in Asian markets during the second half of 2017. Interestingly, when the chip leaked back in March, the specs were almost nailed perfectly.
source: PhoneRadar
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